Abstract
Thin Co films (1-8 nm) were directly, sequentially, and co-deposited with Si (3.6-29.2 nm) on the (√3 × √3)-R30° reconstruction of 6H-SiC(0001). The films were annealed over a temperature range of 823-1373K and investigated with XAFS, XPS, AES and AFM. After annealing up to 1373K directly deposited Co films do not transform entirely to cobalt disilicide and C segregation is observed on the surface of the films. On the other hand, sequentially and co-deposited films do form cobalt disilicide after annealing at 823K, but also show islanding after annealing at 923K.
Original language | English (US) |
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Pages (from-to) | 475-477 |
Number of pages | 3 |
Journal | Journal of Synchrotron Radiation |
Volume | 8 |
Issue number | 2 |
DOIs | |
State | Published - Mar 1 2001 |
Externally published | Yes |
Keywords
- Cobalt silicide
- Metal-semiconductor contacts
- Molecular beam epitaxy
- Silicon carbide