Wireless 3D vertical interconnect with power splitting capability

Aditya Dave, Rhonda Franklin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Power generation reduces at millimeter wave frequencies for emerging system applications, such as 5G. Thus, loss presents many design challenges for complex integrated system design. This paper proposes to alleviate loss associated with vertical interconnects used in such systems. A wireless equal split 3D vertical power divider that offers very low loss is presented. Two near field beams, produced by one source element and a novel frequency selective surface (FSS), are detected by individual receive elements of the same type. This design is scalable, modeled at 13.5GHz and 60GHz. A 13.5GHz scale model is demonstrated for validation. Simulated insertion loss coefficient at 13.5GHz is 3.24dB, with bandwidth of 5.5%. Modeled and measured results are in good agreement.

Original languageEnglish (US)
Title of host publicationIMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1161-1163
Number of pages3
ISBN (Electronic)9781728168159
DOIs
StatePublished - Aug 2020
Event2020 IEEE/MTT-S International Microwave Symposium, IMS 2020 - Virtual, Los Angeles, United States
Duration: Aug 4 2020Aug 6 2020

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2020-August
ISSN (Print)0149-645X

Conference

Conference2020 IEEE/MTT-S International Microwave Symposium, IMS 2020
CountryUnited States
CityVirtual, Los Angeles
Period8/4/208/6/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

  • Frequency selective surface
  • Interconnects
  • Packaging
  • Power divider
  • Slot antennas
  • Wireless

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