Wall superheat excursions in the boiling incipience of dielectric fluids

Avram Bar-Cohen, Terrence W Simon

Research output: Contribution to journalArticlepeer-review

46 Scopus citations


Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

Original languageEnglish (US)
Pages (from-to)19-31
Number of pages13
JournalHeat Transfer Engineering
Issue number3
StatePublished - Jun 1988

Bibliographical note

Funding Information:
This study was supported in part by a grant from the Commercial Chemicals Division of the 3M Company. The authors are grateful to Mr. Wei Tong for his aid in the revision of the manuscript.


Dive into the research topics of 'Wall superheat excursions in the boiling incipience of dielectric fluids'. Together they form a unique fingerprint.

Cite this