Wall superheat excursions in the boiling incipience of dielectric fluids

Avram Bar-Cohen; Terrence W Simon

doi:10.1080/01457638808939668

Wall superheat excursions in the boiling incipience of dielectric fluids

Avram Bar-Cohen, Terrence W Simon

Mechanical Engineering

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49 Scopus citations

Abstract

Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

Original language	English (US)
Pages (from-to)	19-31
Number of pages	13
Journal	Heat Transfer Engineering
Volume	9
Issue number	3
DOIs	https://doi.org/10.1080/01457638808939668
State	Published - Jun 1988

Bibliographical note

Funding Information:
This study was supported in part by a grant from the Commercial Chemicals Division of the 3M Company. The authors are grateful to Mr. Wei Tong for his aid in the revision of the manuscript.

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author = "Avram Bar-Cohen and Simon, {Terrence W}",

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N2 - Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

AB - Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

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Wall superheat excursions in the boiling incipience of dielectric fluids

Abstract

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