TY - GEN
T1 - Wafer-scale packaging for FBAR-based oscillators
AU - Small, Martha
AU - Ruby, Rich
AU - Ortiz, Steven
AU - Parker, Reed
AU - Zhang, Fan
AU - Shi, Jianlei
AU - Otis, Brian
N1 - Copyright:
Copyright 2011 Elsevier B.V., All rights reserved.
PY - 2011
Y1 - 2011
N2 - Recent advances in temperature-compensation for FBAR (Film Bulk Acoustic Resonators) have brought this technology forward as a serious contender in the oscillator marketplace. As with any mechanical resonator oscillator, a cost-effective hermetic package combined with circuit technology are critical for commercial application. Billions of FBAR duplexers have been fabricated using Avago Technologies' wafer-scale packaging process, whereby a silicon lid wafer is Au-diffusion-bonded to a base FBAR wafer to make a robust, hermetic package. This paper presents a method for integrating circuitry into the lid wafer to form a sub-0.1 mm3, sub mW, 1.5 GHz temperature-compensated chip-scale oscillator. Circuit integration, testing and performance will be discussed.
AB - Recent advances in temperature-compensation for FBAR (Film Bulk Acoustic Resonators) have brought this technology forward as a serious contender in the oscillator marketplace. As with any mechanical resonator oscillator, a cost-effective hermetic package combined with circuit technology are critical for commercial application. Billions of FBAR duplexers have been fabricated using Avago Technologies' wafer-scale packaging process, whereby a silicon lid wafer is Au-diffusion-bonded to a base FBAR wafer to make a robust, hermetic package. This paper presents a method for integrating circuitry into the lid wafer to form a sub-0.1 mm3, sub mW, 1.5 GHz temperature-compensated chip-scale oscillator. Circuit integration, testing and performance will be discussed.
UR - https://www.scopus.com/pages/publications/80155134093
UR - https://www.scopus.com/pages/publications/80155134093#tab=citedBy
U2 - 10.1109/FCS.2011.5977848
DO - 10.1109/FCS.2011.5977848
M3 - Conference contribution
AN - SCOPUS:80155134093
SN - 9781612841106
T3 - Proceedings of the IEEE International Frequency Control Symposium and Exposition
BT - 2011 Joint Conference of the IEEE International Frequency Control Symposium and European Frequency and Time Forum, IFCS/EFTF 2011 - Proceedings
T2 - 5th Joint Conference of the 65th IEEE International Frequency Control Symposium, IFCS 2011 and 25th European Frequency and Time Forum, EFTF 2011
Y2 - 1 May 2011 through 5 May 2011
ER -