Wafer packing for full mask exposure fabrication

Ching Ting Wu, Andrew Lim, David Du

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The authors formulate and classify the various models of the wafer packing problem for the full mask exposure technique. Since the wafer packing problem is NP-hard, the authors propose a good heuristic for it. Their experiments, on real test data, indicate that this heuristic is very effective as it provides considerable cost reduction when compared with the traditional way of producing chips.

Original languageEnglish (US)
Title of host publication1991 IEEE International Conference on Computer-Aided Design Digest of Technical Papers
PublisherPubl by IEEE
Pages52-55
Number of pages4
ISBN (Print)0818621575
StatePublished - Dec 1 1992
Event1991 IEEE International Conference on Computer-Aided Design - ICCAD-91 - Santa Clara, CA, USA
Duration: Nov 11 1991Nov 14 1991

Publication series

Name1991 IEEE International Conference on Computer-Aided Design Digest of Technical Papers

Other

Other1991 IEEE International Conference on Computer-Aided Design - ICCAD-91
CitySanta Clara, CA, USA
Period11/11/9111/14/91

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