Abstract
The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 659-660 |
| Number of pages | 2 |
| Journal | Electronics Letters |
| Volume | 34 |
| Issue number | 7 |
| DOIs | |
| State | Published - Apr 2 1998 |
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