Wafer packing for full mask exposure fabrication

David H Du, A. Lim, Ching Ting Wu

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective.

Original languageEnglish (US)
Pages (from-to)659-660
Number of pages2
JournalElectronics Letters
Volume34
Issue number7
DOIs
StatePublished - Apr 2 1998

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