Wafer packing for full mask exposure fabrication

David H Du; A. Lim; Ching Ting Wu

doi:10.1049/el:19980482

Wafer packing for full mask exposure fabrication

David H Du, A. Lim, Ching Ting Wu

Computer Science and Engineering

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

Abstract

The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective.

Original language	English (US)
Pages (from-to)	659-660
Number of pages	2
Journal	Electronics Letters
Volume	34
Issue number	7
DOIs	https://doi.org/10.1049/el:19980482
State	Published - Apr 2 1998

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title = "Wafer packing for full mask exposure fabrication",

abstract = "The authors formulate various models of the wafer packing problem, using a full mask exposure fabrication process, and propose a heuristic for the most general version of the problem. Experiments, on real test data, indicate that the heuristic is effective.",

author = "Du, {David H} and A. Lim and Wu, {Ching Ting}",

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AU - Lim, A.

AU - Wu, Ching Ting

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JO - Electronics Letters

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