Wafer level interconnects for 3D Packaging

Swagata Riki Banerjee, Rhonda Franklin Drayton

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

A hybrid electrical package is compared to monolithic designs to isolate the effects of wirebond parasitics and modularity. The monolithic designs produce 3.2 dB of insertion loss at 50 GHz, which indicates minimal loss due to wirebonds. The hybrid design insertion loss is within 0.5 dB of the reference case up to 40 GHz. The response is oscillatory above this frequency due to complex substrate transitions. Quasi-static modeling techniques are also used to model the wirebond effects with standard CAD tools.

Original languageEnglish (US)
Pages (from-to)1513-1518
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Volume2
StatePublished - Dec 27 2004
Event2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

Fingerprint Dive into the research topics of 'Wafer level interconnects for 3D Packaging'. Together they form a unique fingerprint.

Cite this