A hybrid electrical package is compared to monolithic designs to isolate the effects of wirebond parasitics and modularity. The monolithic designs produce 3.2 dB of insertion loss at 50 GHz, which indicates minimal loss due to wirebonds. The hybrid design insertion loss is within 0.5 dB of the reference case up to 40 GHz. The response is oscillatory above this frequency due to complex substrate transitions. Quasi-static modeling techniques are also used to model the wirebond effects with standard CAD tools.
|Original language||English (US)|
|Number of pages||6|
|Journal||Proceedings - Electronic Components and Technology Conference|
|State||Published - Dec 27 2004|
|Event||2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States|
Duration: Jun 1 2004 → Jun 4 2004