VARIUS-TC: A modular architecture-level model of parametric variation for thin-channel switches

S. Karen Khatamifard, Michael Resch, Nam Sung Kim, Ulya Karpuzcu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations

Abstract

Under aggressive miniaturization, unconventional digital switches rapidly come to light, which introduce new sources of variation in design parameters, and hence challenge the manufacturing process further. As a result, performance and power of manufactured hardware becomes greatly unpredictable. Characterizing variation-incurred unpredictability at early stages of the design necessitates dependable architecture-level models of variation, which distill device- and circuit-level details to accurately evaluate system-level implications. In this paper, we introduce a modular architecture-level model of parametric variation to address this challenge. As a case study, we refine our discussion to a representative class of emerging thin-channel switches, FinFETs.

Original languageEnglish (US)
Title of host publicationProceedings of the 34th IEEE International Conference on Computer Design, ICCD 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages654-661
Number of pages8
ISBN (Electronic)9781509051427
DOIs
StatePublished - Nov 22 2016
Event34th IEEE International Conference on Computer Design, ICCD 2016 - Scottsdale, United States
Duration: Oct 2 2016Oct 5 2016

Other

Other34th IEEE International Conference on Computer Design, ICCD 2016
CountryUnited States
CityScottsdale
Period10/2/1610/5/16

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Khatamifard, S. K., Resch, M., Kim, N. S., & Karpuzcu, U. (2016). VARIUS-TC: A modular architecture-level model of parametric variation for thin-channel switches. In Proceedings of the 34th IEEE International Conference on Computer Design, ICCD 2016 (pp. 654-661). [7753353] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICCD.2016.7753353