The three most common vapor processes are described, including sputtering, evaporation, and chemical vapor deposition. These processes are used primarily to make thin films and nanostructures. First, the kinetic theory of gases is used to show how vacuums control vapor processes. Next, the origin of typical thin film microstructures is discussed. The chapter then details the three processes, including parameters that most affect the resulting materials.
|Original language||English (US)|
|Title of host publication||Materials Processing|
|Subtitle of host publication||A Unified Approach to Processing of Metals, Ceramics and Polymers|
|Number of pages||76|
|State||Published - Jan 1 2016|
Bibliographical notePublisher Copyright:
© 2016 Elsevier Inc. All rights reserved.
- Chemical vapor deposition
- Thin films