Ultra-wideband silicon through-wafer transmission lines

Daniel T. Kollmann, Rhonda Franklin Drayton

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations

Abstract

Wideband vertical interconnects are needed for high density packaging of 3-dimensional designs in electronic and optoelectronic applications. A DC-50 GHz through-wafer transmission line based on a coplanar waveguide configuration is presented. Wideband operation is achieved by printing a CPW on the sidewall of a wet etched cavity. Simulated and measured results are given for several vertical interconnects. The best design exhibits a 0.1 dB loss per vertical interconnect at 40 GHz and a return loss greater than 19 dB from 0.45-50 GHz.

Original languageEnglish (US)
Pages (from-to)489-492
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume2
StatePublished - Sep 20 2004
Event2004 IEEE MITT-S International Microwave Symposium Digest - Fort Worth, TX, United States
Duration: Jun 6 2004Jun 11 2004

Keywords

  • Coplanar waveguides
  • Interconnections
  • Packaging
  • Three-dimensional interconnects
  • Through-wafer interconnects

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