Ultra-broadband integration techniques for high-speed circuits and systems design

Rhonda R. Franklin, Hosaeng Kim, Young Seek Cho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper will describe methods developed to enhance the effective integration of complex systems. A variety of integration techniques will be described for coplanar waveguide based architectures used for in-plane and three-dimensional wafer scale packaging. Each approach offers low loss and low dispersion characteristics from DC to V-band and in special cases W-band.

Original languageEnglish (US)
Title of host publication2010 IEEE 11th Annual Wireless and Microwave Technology Conference, WAMICON 2010
DOIs
StatePublished - Jun 8 2010
Event2010 IEEE 11th Annual Wireless and Microwave Technology Conference, WAMICON 2010 - Melbourne, FL, United States
Duration: Apr 12 2010Apr 13 2010

Publication series

Name2010 IEEE 11th Annual Wireless and Microwave Technology Conference, WAMICON 2010

Other

Other2010 IEEE 11th Annual Wireless and Microwave Technology Conference, WAMICON 2010
CountryUnited States
CityMelbourne, FL
Period4/12/104/13/10

Keywords

  • Coplanar waveguide
  • Filters
  • Flip-chip
  • Integration
  • Silicon
  • Silicon micromachining
  • V-band
  • W-band

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  • Cite this

    Franklin, R. R., Kim, H., & Cho, Y. S. (2010). Ultra-broadband integration techniques for high-speed circuits and systems design. In 2010 IEEE 11th Annual Wireless and Microwave Technology Conference, WAMICON 2010 [5461856] (2010 IEEE 11th Annual Wireless and Microwave Technology Conference, WAMICON 2010). https://doi.org/10.1109/WAMICON.2010.5461856