Abstract
Cross-Technology Communication (CTC) is an enabling technology for efficient coexistence and effective cooperation among heterogeneous wireless devices by exchanging data frames directly without gateways. Recent advances in the physical-layer CTC achieve thousands of times faster speed than that of previous packet-level CTC techniques. However, physical-layer CTC still faces the challenge of inherent unreliability due to the imperfection of physical-layer signal emulation. Our work, named TwinBee, aims to recover the intrinsic errors of physical-layer CTC, by exploring chip-level error patterns. This is achieved interestingly without even observing the chip information and without any hardware modification. System evaluation shows that our key idea, namely symbol-level chip-combining decoding with soft mapping, significantly improves the Packet Reception Ratio (PRR) of the physical-layer CTC from 50%-60% to more than 99%. We also demonstrate the reliability of TwinBee in a data dissemination application over a network of 20 TelosB nodes, achieving over 40x reduction of data dissemination delay compared to Deluge.
| Original language | English (US) |
|---|---|
| Title of host publication | INFOCOM 2018 - IEEE Conference on Computer Communications |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 153-161 |
| Number of pages | 9 |
| ISBN (Electronic) | 9781538641286 |
| DOIs | |
| State | Published - Oct 8 2018 |
| Event | 2018 IEEE Conference on Computer Communications, INFOCOM 2018 - Honolulu, United States Duration: Apr 15 2018 → Apr 19 2018 |
Publication series
| Name | Proceedings - IEEE INFOCOM |
|---|---|
| Volume | 2018-April |
| ISSN (Print) | 0743-166X |
Other
| Other | 2018 IEEE Conference on Computer Communications, INFOCOM 2018 |
|---|---|
| Country/Territory | United States |
| City | Honolulu |
| Period | 4/15/18 → 4/19/18 |
Bibliographical note
Funding Information:IX. ACKNOWLEDGEMENT This work was supported in part by the NSF CNS-1444021, NSF CNS-1718456, NSF China 61303240, NSF China 61672196 and UCAS Cooperation Funding with Institutions Y41101W1A1. We sincerely thank anonymous reviewers for their valuable comments and feedback.
Publisher Copyright:
© 2018 IEEE.
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