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TwinBee: Reliable Physical-Layer Cross-Technology Communication with Symbol-Level Coding

  • Yongrui Chen
  • , Zhijun Li
  • , Tian He

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Cross-Technology Communication (CTC) is an enabling technology for efficient coexistence and effective cooperation among heterogeneous wireless devices by exchanging data frames directly without gateways. Recent advances in the physical-layer CTC achieve thousands of times faster speed than that of previous packet-level CTC techniques. However, physical-layer CTC still faces the challenge of inherent unreliability due to the imperfection of physical-layer signal emulation. Our work, named TwinBee, aims to recover the intrinsic errors of physical-layer CTC, by exploring chip-level error patterns. This is achieved interestingly without even observing the chip information and without any hardware modification. System evaluation shows that our key idea, namely symbol-level chip-combining decoding with soft mapping, significantly improves the Packet Reception Ratio (PRR) of the physical-layer CTC from 50%-60% to more than 99%. We also demonstrate the reliability of TwinBee in a data dissemination application over a network of 20 TelosB nodes, achieving over 40x reduction of data dissemination delay compared to Deluge.

Original languageEnglish (US)
Title of host publicationINFOCOM 2018 - IEEE Conference on Computer Communications
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages153-161
Number of pages9
ISBN (Electronic)9781538641286
DOIs
StatePublished - Oct 8 2018
Event2018 IEEE Conference on Computer Communications, INFOCOM 2018 - Honolulu, United States
Duration: Apr 15 2018Apr 19 2018

Publication series

NameProceedings - IEEE INFOCOM
Volume2018-April
ISSN (Print)0743-166X

Other

Other2018 IEEE Conference on Computer Communications, INFOCOM 2018
Country/TerritoryUnited States
CityHonolulu
Period4/15/184/19/18

Bibliographical note

Funding Information:
IX. ACKNOWLEDGEMENT This work was supported in part by the NSF CNS-1444021, NSF CNS-1718456, NSF China 61303240, NSF China 61672196 and UCAS Cooperation Funding with Institutions Y41101W1A1. We sincerely thank anonymous reviewers for their valuable comments and feedback.

Publisher Copyright:
© 2018 IEEE.

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