TOWARDS TECHNOLOGY TRANSFER: KINEMATIC AND DYNAMIC ANALYSIS OF LINKAGES FOR THE DESIGN ENGINEER.

P. J. Starr, A. G. Erdman

Research output: Contribution to conferencePaper

Abstract

Examines design technology in the area of the kinematic and dynamic analysis of linkages from both the viewpoint of the engineering designer and the researcher with the intention of fostering technology transfer. Various research areas in kinematic and dynamic analysis are explored using the context of problem symptoms as perceived by the machine designer. Analysis methods are discussed in lucid terms with emphasis on relationships between analytically convenient assumptions and the design environment.

Original languageEnglish (US)
Pages335-346
Number of pages12
StatePublished - Jan 1 1974
EventDes Eng Tech Conf, 1st - New York City, NY, USA
Duration: Oct 5 1974Oct 9 1974

Other

OtherDes Eng Tech Conf, 1st
CityNew York City, NY, USA
Period10/5/7410/9/74

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Technology transfer
Dynamic analysis
Kinematics
Engineers

Cite this

Starr, P. J., & Erdman, A. G. (1974). TOWARDS TECHNOLOGY TRANSFER: KINEMATIC AND DYNAMIC ANALYSIS OF LINKAGES FOR THE DESIGN ENGINEER.. 335-346. Paper presented at Des Eng Tech Conf, 1st, New York City, NY, USA, .

TOWARDS TECHNOLOGY TRANSFER : KINEMATIC AND DYNAMIC ANALYSIS OF LINKAGES FOR THE DESIGN ENGINEER. / Starr, P. J.; Erdman, A. G.

1974. 335-346 Paper presented at Des Eng Tech Conf, 1st, New York City, NY, USA, .

Research output: Contribution to conferencePaper

Starr, PJ & Erdman, AG 1974, 'TOWARDS TECHNOLOGY TRANSFER: KINEMATIC AND DYNAMIC ANALYSIS OF LINKAGES FOR THE DESIGN ENGINEER.' Paper presented at Des Eng Tech Conf, 1st, New York City, NY, USA, 10/5/74 - 10/9/74, pp. 335-346.
Starr PJ, Erdman AG. TOWARDS TECHNOLOGY TRANSFER: KINEMATIC AND DYNAMIC ANALYSIS OF LINKAGES FOR THE DESIGN ENGINEER.. 1974. Paper presented at Des Eng Tech Conf, 1st, New York City, NY, USA, .
Starr, P. J. ; Erdman, A. G. / TOWARDS TECHNOLOGY TRANSFER : KINEMATIC AND DYNAMIC ANALYSIS OF LINKAGES FOR THE DESIGN ENGINEER. Paper presented at Des Eng Tech Conf, 1st, New York City, NY, USA, .12 p.
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