Toughening of epoxy using PEP-PEO block copolymer nanoparticles

Jia Liu, Hung Jue Sue, Zachaiy J. Thompson, Frank S. Bates, Mary Dettloff, George Jacob, Nikhil Verghese, Ha Pham

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A block copolymer (BCP) toughening agent, which forms self-assembled spherical micelle particles (15 nm), was utilized to toughen epoxy. The nano-sized BCP at 5 wt% concentration can significantly improve the fracture toughness of epoxy without deterioration in modulus and with only a slight reduction in glass transition temperature (Tg). The major toughening mechanisms are found to be BCP nanoparticle cavitation-induced matrix shear banding. Possible reasons responsible for the remarkable mechanical property improvements due to the BCP modification are discussed.

Original languageEnglish (US)
Title of host publication67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009
PublisherSociety of Plastics Engineers
Pages1342-1345
Number of pages4
ISBN (Print)9781615673278
StatePublished - Jan 1 2009
Event67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009 - Chicago, IL, United States
Duration: Jun 22 2009Jun 24 2009

Publication series

NameAnnual Technical Conference - ANTEC, Conference Proceedings
Volume3

Other

Other67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009
CountryUnited States
CityChicago, IL
Period6/22/096/24/09

Keywords

  • Block copolymer
  • Cavitation
  • Epoxy
  • Nanoparticle
  • Rubber-toughened polymer
  • Toughening mechanism

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  • Cite this

    Liu, J., Sue, H. J., Thompson, Z. J., Bates, F. S., Dettloff, M., Jacob, G., Verghese, N., & Pham, H. (2009). Toughening of epoxy using PEP-PEO block copolymer nanoparticles. In 67th Annual Technical Conference of the Society of Plastics Engineers 2009, ANTEC 2009 (pp. 1342-1345). (Annual Technical Conference - ANTEC, Conference Proceedings; Vol. 3). Society of Plastics Engineers.