Abstract
Titanium dioxide has been deposited on silicon for use as a high-permittivity gate insulator in an effort to produce low-leakage films with oxide equivalent thicknesses below 2.0 nm. Excellent electrical characteristics can be achieved, but TEM and electrical measurements have shown the presence of a low-resistivity interfacial layer that we take to be SiO2. The leakage current follows several mechanisms depending on the bias voltage. Reasonably good agreement has been seen between current-voltage measurements and a 1D quantum transport model.
Original language | English (US) |
---|---|
Pages (from-to) | 383-392 |
Number of pages | 10 |
Journal | IBM Journal of Research and Development |
Volume | 43 |
Issue number | 3 |
DOIs | |
State | Published - May 1999 |