Three dimensional temperature uniformity modeling of a rapid thermal processing chamber

Keyphrases

• 3-dimensional Model 50%
• 8 Inch Wafer 50%
• Body Model 50%
• Chamber Temperature 50%
• Energy Balance 50%
• Filament Lamp 50%
• Filament Temperature 50%
• Gray-body 50%
• Growth Estimates 50%
• Guard Ring 50%
• High Temperature 50%
• Industry Standards 50%
• Lamp 100%
• Low Temperature 50%
• Model Prediction 50%
• Navier-Stokes Solution 50%
• Non-axisymmetric 50%
• Oxide Growth 50%
• Polysilicon 50%
• Power Output 50%
• Process Chamber 100%
• Radiation Transfer 50%
• Rapid Thermal Processing 100%
• Reflectivity 50%
• Silica 50%
• Symmetric Effect 50%
• Temperature Distribution 100%
• Temperature Uniformity 100%
• Thermocouple 50%
• Three-dimensional (3D) 100%
• Transient Phenomena 50%
• Tungsten Filament 50%
• Wafer 100%
• Wafer Temperature 50%

Engineering

• Body Model 50%
• Dimensional Model 50%
• Energy Engineering 50%
• Filament Lamp 100%
• Gray Body 50%
• Industry Standard 50%
• Low-Temperature 50%
• Model Prediction 50%
• Oxide Growth 50%
• Polysilicon 50%
• Power Output 50%
• Processing Chamber 100%
• Rapid Thermal Processing 100%
• Temperature Distribution 100%
• Thermocouple 50%
• Transients 50%

Material Science

• Lamp 100%
• Oxide Compound 33%
• Reflectivity 33%
• Tungsten 33%