Thin film fine line work of adhesion by microwedge indentation

M. P. de Boer, N. R. Moody, H. Huang, William W Gerberich

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

The mechanics for plane strain geometry are presented for thin film fine lines by considering the case of microwedge indentation of a fine line subject to no residual stress. The analysis is separated into three parts depending on the absence or presence of buckling. During indentation, unbuckled or double-buckled configurations may exist, while single-buckling may occur when the indenter tip is removed. A microwedge tip was employed in the indentation testing of unstressed rf-sputtered tungsten fine lines to demonstrate some of the analysis.

Original languageEnglish (US)
Pages (from-to)693-698
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume356
StatePublished - Jan 1 1995
EventProceedings of the 1994 MRS Fall Meeting - Boston, MA, USA
Duration: Nov 28 1994Dec 1 1994

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