Thermophoretic effect of particle deposition on a free standing semiconductor wafer in a clean room

Y. Ye, D. Y.H. Pui, B. Y.H. Liu, S. Opiolka, S. Blumhorst, H. Fissan

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Abstract

The thermophoretic effect of particle deposition on a free standing wafer was studied experimentally and numerically. The experimental study consisted of generating a monodisperse polystyrene latex (PSL) aerosol, transporting the aerosol to a vertical test chamber, depositing the monodisperse aerosol on a wafer surface heated to a desired temperature, and analysing the deposited particles with a wafer inspection system. Experimental data of particle deposition velocity to a free standing wafer at 30 cm s-1 of free stream velocity were obtained for a temperature difference between the wafer surface and the airflow of 10-40°C, and a particle diameter range of 0.6-5 μm. The data were then compared with a numerical model which took into account deposition mechanisms due to convection, diffusion, sedimentation and thermophoresis. The comparison shows good agreement between the measured particle deposition velocity and the numerical results.

Original languageEnglish (US)
Pages (from-to)63-72
Number of pages10
JournalJournal of Aerosol Science
Volume22
Issue number1
DOIs
StatePublished - 1991

Bibliographical note

Funding Information:
Acknowledgement--This research was supported by the Particulate Contamination Control Research Consortium at the University of Minnesota, and by the Special Research Program (SFB 209) at University of Duisburg, financed by the German Science Foundation. Members of the Research Consortium at the University of Minnesota include: Air Products and Chemicals, Applied Materials, The BOC Group, Donaldson Company, Inc., FSI International,

Copyright:
Copyright 2014 Elsevier B.V., All rights reserved.

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