Thermally induced stress hysteresis and co-efficient of thermal expansion changes in nanoporous SiO₂

Chemical Compounds

• Silicon Dioxide 100%
• Thermal Expansion 86%
• Hysteresis 80%
• Nanoporosity 76%
• Desorption 62%
• Strain 57%
• Electron Beam 44%
• Quartz 36%
• Annealing 32%
• Environment 23%
• Hydrogen 20%

Engineering & Materials Science

• Thermal expansion 83%
• Hysteresis 77%
• Desorption 62%
• Silica 56%
• Thin films 51%
• Water 44%
• Nanoindentation 32%
• Temperature 32%
• Electron beams 32%
• Quartz 30%
• Annealing 27%
• Temperature distribution 22%
• Hydrogen 21%
• Substrates 19%

Physics & Astronomy

• thermal expansion 70%
• hysteresis 63%
• desorption 48%
• water 46%
• silicon dioxide 41%
• strain distribution 32%
• thin films 28%
• nanoindentation 27%
• quartz 23%
• curvature 20%
• trends 20%
• electron beams 19%
• hydrogen 16%
• annealing 16%
• temperature 16%