TY - JOUR
T1 - Thermal transport along the dislocation line in silicon carbide
AU - Ni, Yuxiang
AU - Xiong, Shiyun
AU - Volz, Sebastian
AU - Dumitric, Traian
N1 - Publisher Copyright:
© 2014 American Physical Society.
PY - 2014/9/18
Y1 - 2014/9/18
N2 - We elucidate thermal conductivity along the screw dislocation line, which represents a transport direction inaccessible to classical theories. By using equilibrium molecular dynamics simulations, we uncover a Burgers vector dependent thermal conductivity reduction in silicon carbide. The effect is uncorrelated with the classical modeling and originates in the highly deformed core region, which represents a significant source of anharmonic phonon-phonon scattering. High strain reduces the phonon relaxation time, especially in the longitudinal acoustic branches, and creates an effective internal thermal resistance around the dislocation axis. Our results have implications for designing materials useful for high-temperature electronics and thermoelectric applications.
AB - We elucidate thermal conductivity along the screw dislocation line, which represents a transport direction inaccessible to classical theories. By using equilibrium molecular dynamics simulations, we uncover a Burgers vector dependent thermal conductivity reduction in silicon carbide. The effect is uncorrelated with the classical modeling and originates in the highly deformed core region, which represents a significant source of anharmonic phonon-phonon scattering. High strain reduces the phonon relaxation time, especially in the longitudinal acoustic branches, and creates an effective internal thermal resistance around the dislocation axis. Our results have implications for designing materials useful for high-temperature electronics and thermoelectric applications.
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U2 - 10.1103/PhysRevLett.113.124301
DO - 10.1103/PhysRevLett.113.124301
M3 - Article
AN - SCOPUS:84907257132
SN - 0031-9007
VL - 113
JO - Physical Review Letters
JF - Physical Review Letters
IS - 12
M1 - 124301
ER -