TY - GEN
T1 - Thermal signature
T2 - 2011 48th ACM/EDAC/IEEE Design Automation Conference, DAC 2011
AU - Kung, Jaeha
AU - Han, Inhak
AU - Sapatnekar, Sachin S
AU - Shin, Youngsoo
PY - 2011/9/16
Y1 - 2011/9/16
N2 - A floorplanning has a potential to reduce chip temperature due to the conductive nature of heat. If floorplan optimization, which is usually based on simulated annealing, is employed to reduce temperature, its evaluation should be done extremely fast with high accuracy. A new thermal index, named thermal signature, is proposed. It approximates the temperature calculation, which is done by taking the product of Green's function and power density integrated over space. The correlation coefficient between thermal signature and temperature is shown to be quite high, more than 0.7 in many examples. A floorplanner that uses thermal signature is constructed and assessed using real design examples in 32-nm technology. It produces a floorplan whose maximum temperature is 11.4°C smaller than that of standard floorplan, on average, in reasonable amount of runtime.
AB - A floorplanning has a potential to reduce chip temperature due to the conductive nature of heat. If floorplan optimization, which is usually based on simulated annealing, is employed to reduce temperature, its evaluation should be done extremely fast with high accuracy. A new thermal index, named thermal signature, is proposed. It approximates the temperature calculation, which is done by taking the product of Green's function and power density integrated over space. The correlation coefficient between thermal signature and temperature is shown to be quite high, more than 0.7 in many examples. A floorplanner that uses thermal signature is constructed and assessed using real design examples in 32-nm technology. It produces a floorplan whose maximum temperature is 11.4°C smaller than that of standard floorplan, on average, in reasonable amount of runtime.
KW - Thermal analysis
KW - thermal-aware floorplanning
UR - http://www.scopus.com/inward/record.url?scp=80052677826&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=80052677826&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:80052677826
SN - 9781450306362
T3 - Proceedings - Design Automation Conference
SP - 108
EP - 113
BT - 2011 48th ACM/EDAC/IEEE Design Automation Conference, DAC 2011
Y2 - 5 June 2011 through 9 June 2011
ER -