Thermal energy consideration in micromagnetic simulation for laminated antiferromagnetically coupled recording media

C. H. Hee, J. P. Wang, S. N. Piramanayagam, T. C. Chong

Research output: Contribution to journalArticlepeer-review

12 Scopus citations

Abstract

Contribution of thermal energy, has been included in the micromagnetic simulation of laminated antiferromagnetically coupled (LAC) media. The antiferromagnetic coupling constant, J, required to obtain M rt reduction in the existing simulation studies (T = 0 K) of LAC media is much higher than the experimental values. In this letter, we describe some experimental results, which point out that the contribution of thermal energy in M rt reduction is significant. Consequently, we find that the values of J and the reversal fields are comparable to the experimental results, when thermal energy (T = 300 K) is included in the simulation.

Original languageEnglish (US)
Pages (from-to)1646-1648
Number of pages3
JournalApplied Physics Letters
Volume79
Issue number11
DOIs
StatePublished - Sep 10 2001

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