TY - GEN
T1 - Thermal-aware floorplanning for task migration enabled active sub-threshold leakage reduction
AU - Mogal, Hushrav D.
AU - Bazargan, Kia
PY - 2008
Y1 - 2008
N2 - This paper presents a new approach to active sub-threshold leakage reduction using task migration. The main idea is to replicate a hot module in a design so as to actively migrate its computation at regular intervals, reducing the on-chip temperature and thereby the sub-threshold leakage. We observe that choosing which blocks to migrate and their placement in a floorplan is a chicken-and-egg problem. To solve this, we propose a two step floorplanning methodology, wherein, given a base floorplan, we first choose the modules to replicate and then effectively utilize the deadspaces in it by exploiting the lateral conduction of heat in the floorplan to place a module's replica. With an optimized floorplan, using task migration we obtain an average savings of 29% in the active sub-threshold leakage at the expense of about 6% additional area.
AB - This paper presents a new approach to active sub-threshold leakage reduction using task migration. The main idea is to replicate a hot module in a design so as to actively migrate its computation at regular intervals, reducing the on-chip temperature and thereby the sub-threshold leakage. We observe that choosing which blocks to migrate and their placement in a floorplan is a chicken-and-egg problem. To solve this, we propose a two step floorplanning methodology, wherein, given a base floorplan, we first choose the modules to replicate and then effectively utilize the deadspaces in it by exploiting the lateral conduction of heat in the floorplan to place a module's replica. With an optimized floorplan, using task migration we obtain an average savings of 29% in the active sub-threshold leakage at the expense of about 6% additional area.
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U2 - 10.1109/ICCAD.2008.4681590
DO - 10.1109/ICCAD.2008.4681590
M3 - Conference contribution
AN - SCOPUS:57849163128
SN - 9781424428205
T3 - IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
SP - 302
EP - 305
BT - 2008 IEEE/ACM International Conference on Computer-Aided Design Digest of Technical Papers, ICCAD 2008
T2 - 2008 International Conference on Computer-Aided Design, ICCAD
Y2 - 10 November 2008 through 13 November 2008
ER -