Abstract
Slow crack growth during SCC of 7075 aluminum has been shown to comprise both an electrochemical and a mechanical component. These findings prompted a review of several possible mechanical models, and seven possible controlling thermally-activated processes. Since no existing interpretation could satisfy all of the observations, an empirical model was developed. The conclusion is that slight modification of many existing proposed mechanisms could explain the general features of SCC but that any theoretical model must contain some aspect of the mechanical rupture process.
Original language | English (US) |
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Pages (from-to) | 1295-1304 |
Number of pages | 10 |
Journal | Metallurgical and Materials Transactions B: Process Metallurgy and Materials Processing Science |
Volume | 5 |
Issue number | 6 |
DOIs | |
State | Published - Jun 1974 |
Externally published | Yes |
Bibliographical note
Publisher Copyright:© 1974, American Society for Metals, The Melallurgical Society of AIME.
Keywords
- Anodic Dissolution
- Crack Growth Rate
- Metallurgical Transaction
- Stress Corrosion
- Stress Intensity