Test structures for seed layer optimisation of electroplated ferromagnetic films

C. M.Mackenzie Dover; A. W.S. Ross; S. Smith; J. G. Terry; A. R. Mount; A. J. Walton

doi:10.1109/ICMTS.2018.8383766

Test structures for seed layer optimisation of electroplated ferromagnetic films

C. M.Mackenzie Dover, A. W.S. Ross, S. Smith, J. G. Terry, A. R. Mount, A. J. Walton

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.

Original language	English (US)
Title of host publication	ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	63-68
Number of pages	6
ISBN (Electronic)	9781538650691
DOIs	https://doi.org/10.1109/ICMTS.2018.8383766
State	Published - Jun 12 2018
Externally published	Yes
Event	2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018 - Austin, United States Duration: Mar 19 2018 → Mar 22 2018

Publication series

Name	IEEE International Conference on Microelectronic Test Structures
Volume	2018-March

Conference

Conference	2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018
Country/Territory	United States
City	Austin
Period	3/19/18 → 3/22/18

Bibliographical note

Funding Information:
This work has been supported in part by EPSRC (EP/K034510/1). The data reported in this paper is available from https://datashare.is.ed.ac.uk/handle/10283/758

Publisher Copyright:
© 2018 IEEE.

Keywords

Seed layer
characterisation
electroplated ferro-magnetic films
integrated magnetic technologies
nickel
optimisation
test structures

Publisher link

10.1109/ICMTS.2018.8383766

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Dover, C. M. M., Ross, A. W. S., Smith, S., Terry, J. G., Mount, A. R., & Walton, A. J. (2018). Test structures for seed layer optimisation of electroplated ferromagnetic films. In ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures (pp. 63-68). (IEEE International Conference on Microelectronic Test Structures; Vol. 2018-March). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICMTS.2018.8383766

Test structures for seed layer optimisation of electroplated ferromagnetic films. / Dover, C. M.Mackenzie; Ross, A. W.S.; Smith, S. et al.
ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures. Institute of Electrical and Electronics Engineers Inc., 2018. p. 63-68 (IEEE International Conference on Microelectronic Test Structures; Vol. 2018-March).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Dover, CMM, Ross, AWS, Smith, S, Terry, JG, Mount, AR & Walton, AJ 2018, Test structures for seed layer optimisation of electroplated ferromagnetic films. in ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures. IEEE International Conference on Microelectronic Test Structures, vol. 2018-March, Institute of Electrical and Electronics Engineers Inc., pp. 63-68, 2018 IEEE International Conference on Microelectronic Test Structures, ICMTS 2018, Austin, United States, 3/19/18. https://doi.org/10.1109/ICMTS.2018.8383766

Dover CMM, Ross AWS, Smith S, Terry JG, Mount AR, Walton AJ. Test structures for seed layer optimisation of electroplated ferromagnetic films. In ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures. Institute of Electrical and Electronics Engineers Inc. 2018. p. 63-68. (IEEE International Conference on Microelectronic Test Structures). doi: 10.1109/ICMTS.2018.8383766

Dover, C. M.Mackenzie ; Ross, A. W.S. ; Smith, S. et al. / Test structures for seed layer optimisation of electroplated ferromagnetic films. ICMTS 2018 - Proceedings of the 2018 IEEE International Conference on Microelectronic Test Structures. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 63-68 (IEEE International Conference on Microelectronic Test Structures).

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abstract = "This paper presents a full wafer test structure, designed to quantify the effect of seed layer thickness and conductivity on the plating uniformity of patterned electroplated structures. The test structure enables the effect of IR drop on the electroplated film to be evaluated and provides information to help facilitate the optimisation of seed layer thickness.",

keywords = "Seed layer, characterisation, electroplated ferro-magnetic films, integrated magnetic technologies, nickel, optimisation, test structures",

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AU - Walton, A. J.

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Test structures for seed layer optimisation of electroplated ferromagnetic films

Abstract

Publication series

Conference

Bibliographical note

Keywords

Publisher link

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