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Abstract
We present novel in-situ scanning electron microscope experiments exploring the fracture of silicon as a function of temperature at the microscale, from room temperature to 600 °C. Clear post mortem TEM observations of dislocation activity at and above 450 °C suggest that back stresses from crack-tip dislocation emission raise the applied stress intensity at initiation, as part of a brittle to ductile transition starting at 300 °C. This is in agreement with other microscale measurements; however, these experiments are particularly noteworthy in their ability to directly observe crack advance and perform post-mortem analysis to investigate dislocation activity.
Original language | English (US) |
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Pages (from-to) | 78-82 |
Number of pages | 5 |
Journal | Scripta Materialia |
Volume | 130 |
DOIs | |
State | Published - Mar 15 2017 |
Bibliographical note
Publisher Copyright:© 2016 Acta Materialia Inc.
Keywords
- Brittle-to-ductile transition
- Electron microscopy
- Fracture
- Nanomechanical testing
- Silicon
MRSEC Support
- Shared
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Dive into the research topics of 'Temperature dependent fracture initiation in microscale silicon'. Together they form a unique fingerprint.Projects
- 2 Finished
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University of Minnesota MRSEC (DMR-1420013)
Lodge, T. P. (PI)
11/1/14 → 10/31/20
Project: Research project