Temperature-aware placement for SOCs

Keyphrases

• Thermal Modeling 100%
• Placement Algorithm 100%
• Temperature Sensing 100%
• Three-dimensional (3D) 50%
• High Temperature 50%
• Temperature Effect 50%
• Chip-level 50%
• Reliability Issues 50%
• Simulation Method 50%
• Two Dimensional 50%
• Thermal Analysis 50%
• Temperature Distribution 50%
• Function-based 50%
• Random Walk 50%
• System-on-chip 50%
• Power Consumption 50%
• Modeling Method 50%
• Matrix Synthesis 50%
• Finite-difference Time-domain 50%
• Green's Function 50%
• Simulated Annealing 50%
• Failure Time 50%
• Placement Optimization 50%
• Power Integration 50%
• Integration Density 50%
• Force-directed 50%
• Thermal Simulation 50%
• Finite Element Model Reduction 50%
• Timing Failures 50%
• Time Domain Finite Element 50%
• Tapeout 50%
• Thermal Integrity 50%
• Thermal-aware 50%

Engineering

• Reliability Issue 100%
• Finite Element Modeling 100%
• Two Dimensional 100%
• Electric Power Utilization 100%
• Time Domain 100%
• System-on-Chip 100%
• Matrix Synthesis 100%
• Simulation Method 100%
• Future Trend 100%
• Model Reduction 100%
• Temperature Distribution 100%
• Green's Functions 100%

Computer Science

• Placement Algorithm 100%
• Modeling and Simulation 50%
• Power Consumption 50%
• finite difference time domain 50%
• Finite-Difference Time-Domain (FDTD) 50%
• Simulated Annealing 50%
• Random Walk 50%
• Finite Element Analysis 50%
• System-on-Chip 50%
• Temperature Distribution 50%