Temperature as a first-class citizen in chip design

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

With new technology trends, arising through a confluence of factors such as Moore's law scaling and 3D integration, the role of thermal design is inexorably shifting from package-centric issues towards on-chip optimizations. This talk overviews the roots of this change, the circuit effects of elevated temperatures, and on-chip optimizations for effective thermal management.

Original languageEnglish (US)
Title of host publication15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009
Number of pages1
StatePublished - Dec 16 2009
Event15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009 - Leuven, Belgium
Duration: Oct 7 2009Oct 9 2009

Other

Other15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009
CountryBelgium
CityLeuven
Period10/7/0910/9/09

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