Abstract
With new technology trends, arising through a confluence of factors such as Moore's law scaling and 3D integration, the role of thermal design is inexorably shifting from package-centric issues towards on-chip optimizations. This talk overviews the roots of this change, the circuit effects of elevated temperatures, and on-chip optimizations for effective thermal management.
| Original language | English (US) |
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| Title of host publication | 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009 |
| Number of pages | 1 |
| State | Published - Dec 16 2009 |
| Event | 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009 - Leuven, Belgium Duration: Oct 7 2009 → Oct 9 2009 |
Other
| Other | 15th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2009 |
|---|---|
| Country/Territory | Belgium |
| City | Leuven |
| Period | 10/7/09 → 10/9/09 |