Stitched methods of e-textile fabrication offer durability and flexibility benefits, as well as relatively un-constrained layout patterns. The ability to affix discrete component packages without a PCB substrate would improve the overall flexibility and comfort of an e-textile garment. However, that level of integration between electronic and apparel manufacturing processes is difficult to achieve. Here we present the development of a stitched method of fabricating e-textile circuits with surface-mount components. The technique leverages technologies and methods common to sewn product manufacturing. Using a simulated high-intensity wear test, we evaluate the durability of this method for circuit architecture variables of component size, trace width, and trace orientation, as well as for methodological variables of solder deposition technique and reflow process. We show durability of 3% failure after a 14-hour wear test for the best manufacturing conditions. Further, we implement the manufacturing technique in an LED matrix display application.
|Original language||English (US)|
|Title of host publication||ISWC 2017 - Proceedings of the 2017 ACM International Symposium on Wearable Computers|
|Publisher||Association for Computing Machinery|
|Number of pages||8|
|State||Published - Sep 11 2017|
|Event||29th ACM International Symposium on Wearable Computers, ISWC 2017 - Maui, United States|
Duration: Sep 11 2017 → Sep 15 2017
|Name||Proceedings - International Symposium on Wearable Computers, ISWC|
|Conference||29th ACM International Symposium on Wearable Computers, ISWC 2017|
|Period||9/11/17 → 9/15/17|
Bibliographical notePublisher Copyright:
© 2017 Association for Computing Machinery.
Copyright 2018 Elsevier B.V., All rights reserved.
- SMD fabrication
- Smart clothing
- Wearable technology