Surface-mount component attachment for E-textiles

Mary Ellen Berglund; Julia Duvall; Cory Simon; Lucy E Dunne

doi:10.1145/2802083.2808413

Surface-mount component attachment for E-textiles

Mary Ellen Berglund
, Julia Duvall
, Cory Simon
, Lucy E Dunne

Apparel Design

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

40 Scopus citations

Abstract

Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.

Original language	English (US)
Title of host publication	ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers
Publisher	Association for Computing Machinery, Inc
Pages	65-66
Number of pages	2
ISBN (Electronic)	9781450335782
DOIs	https://doi.org/10.1145/2802083.2808413
State	Published - Sep 7 2015
Event	19th ACM International Symposium on Wearable Computers, ISWC 2015 - Osaka, Japan Duration: Sep 7 2015 → Sep 11 2015

Publication series

Name	ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers

Other

Other	19th ACM International Symposium on Wearable Computers, ISWC 2015
Country/Territory	Japan
City	Osaka
Period	9/7/15 → 9/11/15

Bibliographical note

Funding Information:
This research was supported by the National Science Foundation under grant #CNS-1253581.

Publisher Copyright:
© Copyright 2015 ACM.

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Publisher link

10.1145/2802083.2808413

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Berglund, M. E., Duvall, J., Simon, C., & Dunne, L. E. (2015). Surface-mount component attachment for E-textiles. In ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers (pp. 65-66). (ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers). Association for Computing Machinery, Inc. https://doi.org/10.1145/2802083.2808413

Surface-mount component attachment for E-textiles. / Berglund, Mary Ellen; Duvall, Julia; Simon, Cory et al.
ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers. Association for Computing Machinery, Inc, 2015. p. 65-66 (ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Berglund, ME, Duvall, J, Simon, C & Dunne, LE 2015, Surface-mount component attachment for E-textiles. in ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers. ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers, Association for Computing Machinery, Inc, pp. 65-66, 19th ACM International Symposium on Wearable Computers, ISWC 2015, Osaka, Japan, 9/7/15. https://doi.org/10.1145/2802083.2808413

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abstract = "Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount {"}fabric PCBs{"} using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.",

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note = "Funding Information: This research was supported by the National Science Foundation under grant \#CNS-1253581. Publisher Copyright: {\textcopyright} Copyright 2015 ACM.; 19th ACM International Symposium on Wearable Computers, ISWC 2015 ; Conference date: 07-09-2015 Through 11-09-2015",

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AB - Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.

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Surface-mount component attachment for E-textiles

Abstract

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Bibliographical note

UN SDGs

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