Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.
|Original language||English (US)|
|Title of host publication||ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers|
|Publisher||Association for Computing Machinery, Inc|
|Number of pages||2|
|State||Published - Sep 7 2015|
|Event||19th ACM International Symposium on Wearable Computers, ISWC 2015 - Osaka, Japan|
Duration: Sep 7 2015 → Sep 11 2015
|Name||ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers|
|Other||19th ACM International Symposium on Wearable Computers, ISWC 2015|
|Period||9/7/15 → 9/11/15|
Bibliographical noteFunding Information:
This research was supported by the National Science Foundation under grant #CNS-1253581.
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