Surface-mount component attachment for E-textiles

Mary Ellen Berglund, Julia Duvall, Cory Simon, Lucy E Dunne

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Scopus citations

Abstract

Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.

Original languageEnglish (US)
Title of host publicationISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers
PublisherAssociation for Computing Machinery, Inc
Pages65-66
Number of pages2
ISBN (Electronic)9781450335782
DOIs
StatePublished - Sep 7 2015
Event19th ACM International Symposium on Wearable Computers, ISWC 2015 - Osaka, Japan
Duration: Sep 7 2015Sep 11 2015

Publication series

NameISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers

Other

Other19th ACM International Symposium on Wearable Computers, ISWC 2015
Country/TerritoryJapan
CityOsaka
Period9/7/159/11/15

Bibliographical note

Funding Information:
This research was supported by the National Science Foundation under grant #CNS-1253581.

Publisher Copyright:
© Copyright 2015 ACM.

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