Superlayer residual stress effect on the indentation adhesion measurements

Alex A. Volinsky, Neville R. Moody, William W. Gerberich

Research output: Contribution to journalConference articlepeer-review

14 Scopus citations

Abstract

The practical work of adhesion has been measured in thin aluminum films as a function of film thickness and residual stress. These films were sputter deposited onto thermally oxidized silicon wafers followed by sputter deposition of a one micron thick W superlayer. The superlayer deposition parameters were controlled to produce either a compressive residual stress of 1 GPa or a tensile residual stress of 100 MPa. Nanoindentation testing was then used to induce delamination and a mechanics based model for circular blister formation was used to determine practical works of adhesion. The resulting measured works of adhesion for all films between 100 nm and 1 μm thick was 30 J/m2 regardless of superlayer stress. However, films with the compressively stressed superlayers produced larger blisters than films with tensile stressed superlayers. In addition, these films were susceptible to radial cracking producing a high variability in average adhesion values.

Original languageEnglish (US)
Pages (from-to)383-388
Number of pages6
JournalMaterials Research Society Symposium - Proceedings
Volume594
StatePublished - Dec 11 2000
EventThin Films-Stress and Machanical Properties VIII - Boston, MA, USA
Duration: Nov 29 1999Dec 3 1999

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