Superhydrophilic surface modification of copper surfaces by Layer-by-Layer self-assembly and Liquid Phase Deposition of TiO2 thin film

Benjamin T. McDonald, Tianhong Cui

Research output: Contribution to journalArticlepeer-review

38 Scopus citations

Abstract

A new method has been developed for the superhydrophilic surface modification of copper using versatile solution-based fabrication techniques. The high surface area of TiO2 nanoparticles was exploited to create a thin film with increased surface energy that transformed copper materials from relatively hydrophobic to superhydrophilic. Copper exposed to ambient conditions resulting in a thin layer of copper oxide has a water contact angle near 90°, but following TiO2 modification, the contact angle dropped to 0° The thin film responsible for this drastic improvement in wettability proved durable by retaining its excellent properties throughout an extended application of thermal stress. SEM and Raman Spectroscopic analysis confirmed the structural integrity of the film before and after a durability test.

Original languageEnglish (US)
Pages (from-to)1-6
Number of pages6
JournalJournal of Colloid And Interface Science
Volume354
Issue number1
DOIs
StatePublished - Feb 1 2011

Keywords

  • Liquid Phase Deposition
  • Nanoparticle
  • Self assembly
  • TiO

Fingerprint Dive into the research topics of 'Superhydrophilic surface modification of copper surfaces by Layer-by-Layer self-assembly and Liquid Phase Deposition of TiO<sub>2</sub> thin film'. Together they form a unique fingerprint.

Cite this