Superhydrophilic surface modification of copper surfaces by Layer-by-Layer self-assembly and Liquid Phase Deposition of TiO2 thin film

Benjamin T. McDonald; Tianhong Cui

doi:10.1016/j.jcis.2010.09.036

Superhydrophilic surface modification of copper surfaces by Layer-by-Layer self-assembly and Liquid Phase Deposition of TiO₂ thin film

Benjamin T. McDonald, Tianhong Cui

Research output: Contribution to journal › Article › peer-review

49 Scopus citations

Abstract

A new method has been developed for the superhydrophilic surface modification of copper using versatile solution-based fabrication techniques. The high surface area of TiO₂ nanoparticles was exploited to create a thin film with increased surface energy that transformed copper materials from relatively hydrophobic to superhydrophilic. Copper exposed to ambient conditions resulting in a thin layer of copper oxide has a water contact angle near 90°, but following TiO₂ modification, the contact angle dropped to 0° The thin film responsible for this drastic improvement in wettability proved durable by retaining its excellent properties throughout an extended application of thermal stress. SEM and Raman Spectroscopic analysis confirmed the structural integrity of the film before and after a durability test.

Original language	English (US)
Pages (from-to)	1-6
Number of pages	6
Journal	Journal of Colloid And Interface Science
Volume	354
Issue number	1
DOIs	https://doi.org/10.1016/j.jcis.2010.09.036
State	Published - Feb 1 2011

Bibliographical note

Funding Information:
This work was partially sponsored by DARPA MTO Thermal Ground Plane Program. We also acknowledge the assistance at the Nanofabrication Center and Characterization Facility at the University of Minnesota, which are supported by NSF through NNIN.

Keywords

Liquid Phase Deposition
Nanoparticle
Self assembly
TiO

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10.1016/j.jcis.2010.09.036

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abstract = "A new method has been developed for the superhydrophilic surface modification of copper using versatile solution-based fabrication techniques. The high surface area of TiO2 nanoparticles was exploited to create a thin film with increased surface energy that transformed copper materials from relatively hydrophobic to superhydrophilic. Copper exposed to ambient conditions resulting in a thin layer of copper oxide has a water contact angle near 90°, but following TiO2 modification, the contact angle dropped to 0° The thin film responsible for this drastic improvement in wettability proved durable by retaining its excellent properties throughout an extended application of thermal stress. SEM and Raman Spectroscopic analysis confirmed the structural integrity of the film before and after a durability test.",

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