Abstract
A simple method is described for forming rugged superconducting solder contacts to niobium thin films, using an indium-lead-tin solder alloy.
Original language | English (US) |
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Pages (from-to) | 149-150 |
Number of pages | 2 |
Journal | Cryogenics |
Volume | 35 |
Issue number | 2 |
DOIs | |
State | Published - 1995 |
Keywords
- superconducting contact
- superconducting wire bond
- superconductor thin-film device fabrication