Substrate planarization studies on IBAD substrates

Keyphrases

• Atomic Force Microscopy 100%
• Planarization 100%
• Ion Beam Assisted Deposition 100%
• Ar Pressure 66%
• Radio Frequency Power 66%
• Inductively Coupled 66%
• Inconel 66%
• Surface Profilometer 66%
• Microscopic Analysis 33%
• Superconductor 33%
• Varying Condition 33%
• Surface Roughness 33%
• Substrate Roughness 33%
• Coil Antenna 33%
• Ar Plasma 33%
• Buffer Layer 33%
• Average Roughness 33%
• RA Value 33%
• Radio Frequency Plasma 33%
• Average Surface Roughness 33%
• Metallic Substrate 33%
• Discharge System 33%
• Surface Roughness Ra 33%
• Pancake Coil 33%
• Plasma Condition 33%
• Radio-frequency Discharge 33%
• Etched Substrate 33%

Engineering

• Assisted Deposition 100%
• Planarization 100%
• Radio Frequency 100%
• Atomic Force Microscopy 75%
• Torr 50%
• Antenna 25%
• Ar Plasma 25%
• Minute (Time) 25%
• Buffer Layer 25%
• Average Surface Roughness 25%
• Superconductor 25%