Abstract
This work presents statistical data collected from 38 power grid test structures showing the detailed impact of temperature gradient on electro migration (EM) lifetime. The failure time, order, and location under different temperature gradients were compared to show that unexpected early EM failures can occur at temperature gradient regions due to accelerated tensile stress evolution inside the wire.
Original language | English (US) |
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Title of host publication | 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
ISBN (Electronic) | 9781665456722 |
DOIs | |
State | Published - 2023 |
Event | 61st IEEE International Reliability Physics Symposium, IRPS 2023 - Monterey, United States Duration: Mar 26 2023 → Mar 30 2023 |
Publication series
Name | 2023 IEEE International Reliability Physics Symposium (IRPS) |
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Conference
Conference | 61st IEEE International Reliability Physics Symposium, IRPS 2023 |
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Country/Territory | United States |
City | Monterey |
Period | 3/26/23 → 3/30/23 |
Bibliographical note
Publisher Copyright:© 2023 IEEE.
Keywords
- Electromigration
- TTF
- on-chip heater
- power grid
- reliability
- temperature gradient
- void