Abstract
Metal-reinforced diamond composite films produced by a three-step process are studied by examining the nature and interaction of the three types of interfaces present in the composite: diamond-substrate, binder-substrate and diamond-binder. Diamond composites were deposited on tungsten substrates with nickel or CuTiAg alloy binders. It is found that a diffusion bond formed between the binder and the substrate. In addition, carbide-forming elements are found to segregate to the diamond-binder interface. The binding state of the diffused elements was studied by examining the fine structure of the Auger spectra. Carbon at the interface between the binder and the diamond is found to have carbide-type bonding which should improve the adherence of the binder to the diamond.
Original language | English (US) |
---|---|
Pages (from-to) | 181-186 |
Number of pages | 6 |
Journal | Thin Solid Films |
Volume | 237 |
Issue number | 1-2 |
DOIs | |
State | Published - Jan 1 1994 |
Bibliographical note
Funding Information:The authors would like to acknowledge Professor Lorraine F. Francis and Dr. Robert Stokes for useful discussions. The use of the chemical analysis facilities in the Surface Analysis Center, University of Minnesota is gratefully acknowledged. This work has been supported by the NSF under grant NSF/ECD-8721545, ERC for