Stress-based Electromigration Modeling in IC Design: Moving from Theory to Practice

Susann Rothe, Jens Lienig, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Recent research has shown that current density-based models for electromigration (EM) lack precision and should be replaced by physics-based hydrostatic stress simulation. While this new approach is widely accepted in the research community, it has not yet found its way into mainstream IC design flows. This paper aims at bringing state-of-the-art stress-based EM modeling into practical IC design. This is achieved by first examining the reasons that prevent the use of stress modeling in today's verification flows, and then proposing solutions that address these obstacles, such as extracting the necessary technology information from standard IC lifetime testing. The proposed stress modeling approach is used to calculate the EM lifetime for example structures based on equivalent RC circuits, using common IC design tools. Finally, the presented approach is further verified by implementing reservoirs for extending interconnect lifetime.

Original languageEnglish (US)
Title of host publicationProceedings - 2024 20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2024
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350351927
StatePublished - 2024
Externally publishedYes
Event20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2024 - Volos, Greece
Duration: Jul 2 2024Jul 5 2024

Publication series

NameProceedings - 2024 20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2024

Conference

Conference20th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design, SMACD 2024
Country/TerritoryGreece
CityVolos
Period7/2/247/5/24

Bibliographical note

Publisher Copyright:
© 2024 IEEE.

Keywords

  • Electromigration
  • IC design
  • Lifetime
  • Stress

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