Strain in electroless copper films monitored by X-ray diffraction during and after deposition and its dependence on bath chemistry

Keyphrases

• Electrolyte 100%
• X Ray Diffraction 100%
• Film Growth 100%
• Compressive Strain 100%
• Bath Chemistry 100%
• Electroless Copper Film 100%
• X-ray 50%
• Cyanide 50%
• Steady State 50%
• Nitrogen Compounds 50%
• Crystallites 50%
• Strain Measurement 50%
• Tensile Strain 50%
• Ni(II) Ions 50%
• Polymer Substrate 50%
• In Situ X-ray Diffraction 50%
• Cu-Ni 50%
• Evolutionary Patterns 50%
• Copper Film 50%
• Autocatalytic 50%
• Constant Strain 50%
• Compound Yield 50%
• Electroless Deposition 50%
• Strain Variation 50%
• Electrolyte Type 50%
• Ni-free 50%
• Cu Layer 50%
• Chemical Formulation 50%
• Plating Solution 50%
• Aromatic Nitrogen 50%
• Polycrystalline Copper 50%
• Electroless 50%
• Ni Film 50%
• Residual Tensile Strain 50%
• Strain Monitoring 50%

Material Science

• Film 100%
• X-Ray Diffraction 100%
• Plating 42%
• Tensile Strain 28%
• Film Growth 28%
• Strain Measurement 14%
• Electroless Deposition 14%
• Nickel Ion 14%
• Crystallite 14%