Spatial Patterning of Colloidal Nanoparticle-Based Thin Film by a Combinative Technique of Layer-by-Layer Self-Assembly and Lithography

Feng Hua, Yuri Lvov, Tianhong Cui

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

A novel approach to generating clear patterns of different types of nanoparticles is presented in this paper. Nanoassembly in the vertical direction was combined with planar micropatterning. This provides industrial applications of a popular layer-by-layer method to produce multilayers of polymers, nanoparticles, and proteins organized on the nanometer scale. A thin film of organic polystyrene spheres was first coated on the pretreated silicon wafer with layer-by-layer self-assembly. Then a layer of aluminum was deposited on the thin film. A layer of positive photoresist was spun on the surface of aluminum and then illuminated with UV light. The exposed parts of the resist were removed and windows were opened above the aluminum. The subsequent etching removed exposed aluminum and left a polystyrene thin film in the open windows. Oxygen plasma was employed to remove the polystyrene thin film on the bottom. Eventually, aluminum and photoresist were removed and only the desired pattern remained. This approach was also employed for the patterning of the silica nanoparticle thin film, a widely used material in various applications. In this case, wet etching was demonstrated to etch silica particles. A scanning electron microscope was used to produce the image of the pattern.

Original languageEnglish (US)
Pages (from-to)357-361
Number of pages5
JournalJournal of Nanoscience and Nanotechnology
Volume2
Issue number3-4
DOIs
StatePublished - Jun 1 2002

Keywords

  • Layer-by-Layer Self-Assembly
  • Lithography
  • Metal Mask
  • Nanoparticle
  • Patterning

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