SOI wafer mold with high-aspect-ratio microstructures for hot embossing process

Keyphrases

• Wafer 100%
• Insulator 100%
• Hot Embossing 100%
• Silicon Oil 100%
• Inductive Coupled 100%
• Embossing Process 100%
• High-aspect-ratio Microstructures 100%
• Smooth Surface 50%
• Aspect Ratio 50%
• Etching Process 50%
• Mold Insert 50%
• Open Area 50%
• Uniform Thickness 50%

Engineering

• High Aspect Ratio Microstructures 100%
• Good Result 50%
• Smooth Surface 50%
• Mould Insert 50%
• Open Area 50%
• Etching Process 50%
• Aspect Ratio 50%