Size distribution monitoring for chemical mechanical polishing slurries: An intercomparison of electron microscopy, dynamic light scattering, and differential mobility analysis

Jihyeon Lee, Siqin He, Guanyu Song, Christopher J. Hogan

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

In chemical mechanical planarization (CMP), a particle slurry is used in polishing semiconductor wafers. Key to CMP performance is the size distribution of the particles. We evaluate the potential of an aerosol technique, namely differential mobility analysis (in a liquid nanoparticle sizer, LNS, system) to characterize size distributions of CMP slurries. LNS measurements are compared to size distributions inferred from electron microscopy (SEM), and dynamic light scattering (DLS). LNS measurements are more repeatable than DLS measurements, and for 4 silica slurries, LNS distributions are in better agreement with SEM measurements than DLS. We find also that the LNS can quantify multimodal size distributions. For non-silica slurries, LNS, DLS, and SEM measurements have geometric mean diameters which can vary from another by 10 nm or more. However, because each measurement type is internally consistent, the combination of LNS and DLS, which are automated, yields augmented information on slurry properties.

Original languageEnglish (US)
Pages (from-to)395-405
Number of pages11
JournalPowder Technology
Volume396
DOIs
StatePublished - Jan 1 2022

Bibliographical note

Funding Information:
This work was supported by Kanomax FMT Inc. . SEM images were collected using instruments at the Characterization Facility, University of Minnesota, which receives partial support from the NSF through the MRSEC (Award Number DMR-2011401 ) and the NNCI (Award Number ECCS-2025124) programs.

Funding Information:
This work was supported by Kanomax FMT Inc. SEM images were collected using instruments at the Characterization Facility, University of Minnesota, which receives partial support from the NSF through the MRSEC (Award Number DMR-2011401) and the NNCI (Award Number ECCS-2025124) programs.

Publisher Copyright:
© 2021 Elsevier B.V.

Keywords

  • Chemical-mechanical polishing slurry
  • Differential mobility analysis
  • Dynamic light scattering
  • Size distribution measurement

How much support was provided by MRSEC?

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