Simulation of silicon anisotropic etching using cellular automata method

Yanfeng Jiang, Qing'an Huang

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

Simulation of silicon anisotropic etching is made using cellular automata method. According to material property of silicon and etching process, the relevant function is listed. Moreover, a software named SSAE is finished with which the etching process and results can be simulated. Its results accord to other softwares and experiments. Compared with other similar software, SSAE has some advantages, such as independence to hardware and operation system, economization, high simulation speed, etc.

Original languageEnglish (US)
Pages (from-to)618-623
Number of pages6
JournalPan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors
Volume26
Issue number3
StatePublished - Mar 1 2005

Keywords

  • Anisotropic etching
  • Cellular automata
  • Simulation

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