Simulation of particle growth and transport in a dusty plasma

S. J. Warthesen, S. L. Girshick

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The formation of dust particles during plasma-enhanced chemical vapor deposition can be beneficial to the properties of silicon thin films if deposition size and concentration can be controlled. Particle growth, transport, and charging models are combined with a plasma model to predict the size, charge, and spatial distributions of particles under typical deposition conditions. Plasma-particle interactions are discussed, and charge distribution results are presented. Positively charged particles are found to exist in regions near the electrodes, and may have a significant impact on both particle growth and film composition.

Original languageEnglish (US)
Title of host publicationNEW VISTAS IN DUSTY PLASMAS
Subtitle of host publicationFourth International Conference on the Physics of Dusty Plasmas
Pages205-208
Number of pages4
DOIs
StatePublished - Oct 31 2005
Event4th International Conference on the Physics of Dusty Plasmas - Orleans, France
Duration: Jun 13 2005Jun 17 2005

Publication series

NameAIP Conference Proceedings
Volume799
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Other

Other4th International Conference on the Physics of Dusty Plasmas
Country/TerritoryFrance
CityOrleans
Period6/13/056/17/05

Keywords

  • Coagulation
  • Nanoparticle charging
  • Plasma-enhanced chemical vapor deposition

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