Simulation and fabrication of novel polymeric tunneling sensor by hot embossing technique

Tianhong Cui, Kody Varahramyan, Yongjun Zhao, Jing Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports the simulation and fabrication of novel polymer-based tunneling sensors by hot embossing technique, one of the advanced polymer microfabrication technologies. ANSYS is the software tools used to simulate the mechanical microstructures of the polymer tunneling sensors. Following the optimum design of the sensors, the mold inserts of hot embossing are fabricated by anodic bonding of glass disk 5 mm think and silicon wafer, with high-aspect-ratio microstructures by ICP etching. Main structures of polymer-based tunneling sensors are hot embossed on PMMA, followed by plastic bonding to form lateral tunneling sensor platform.

Original languageEnglish (US)
Title of host publicationMicroelectromechanical Systems
PublisherAmerican Society of Mechanical Engineers (ASME)
Pages611-620
Number of pages10
ISBN (Print)0791836428, 9780791836422
DOIs
StatePublished - Jan 1 2002

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings

Keywords

  • Comb structure
  • Hot embossing
  • MEMS
  • Tunneling sensor

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    Cui, T., Varahramyan, K., Zhao, Y., & Wang, J. (2002). Simulation and fabrication of novel polymeric tunneling sensor by hot embossing technique. In Microelectromechanical Systems (pp. 611-620). (ASME International Mechanical Engineering Congress and Exposition, Proceedings). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2002-32745