Abstract
Conventional thermosetting resins, such as epoxies and polyimides, have served the printed wiring board (PWB) industry well for many years. However, in recent years, trends such as ever increasing computational speed and the revolution in personal communication have led to considerable interest in resins which provide lower dielectric constant and dissipation factor. A new silicon-carbon resin technology has been developed to meet these needs. The technology also provides exceptional moisture resistance. An overview of the chemistry and properties of silicon-carbon resins is given, followed by a more detailed presentation of the electrical properties, thermal properties, and moisture resistance of silicon-carbon resin based laminate. These properties are compared with the properties of traditional laminate materials. PWB fabrication is also briefly discussed.
| Original language | English (US) |
|---|---|
| Title of host publication | International SAMPE Electronics Conference |
| Publisher | SAMPE |
| Pages | 200-210 |
| Number of pages | 11 |
| Volume | 7 |
| State | Published - Dec 1 1994 |
| Event | Proceedings of the 1994 7th International SAMPE Electronics Conference - Parsippany, NJ, USA Duration: Jun 20 1994 → Jun 23 1994 |
Other
| Other | Proceedings of the 1994 7th International SAMPE Electronics Conference |
|---|---|
| City | Parsippany, NJ, USA |
| Period | 6/20/94 → 6/23/94 |