Silicon-carbon resin technology for high performance PWB applications

L. M. Babcock, J. K. Bard, R. L. Brady, J. S. Burnier, R. L. Singletary

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Conventional thermosetting resins, such as epoxies and polyimides, have served the printed wiring board (PWB) industry well for many years. However, in recent years, trends such as ever increasing computational speed and the revolution in personal communication have led to considerable interest in resins which provide lower dielectric constant and dissipation factor. A new silicon-carbon resin technology has been developed to meet these needs. The technology also provides exceptional moisture resistance. An overview of the chemistry and properties of silicon-carbon resins is given, followed by a more detailed presentation of the electrical properties, thermal properties, and moisture resistance of silicon-carbon resin based laminate. These properties are compared with the properties of traditional laminate materials. PWB fabrication is also briefly discussed.

Original languageEnglish (US)
Title of host publicationInternational SAMPE Electronics Conference
PublisherSAMPE
Pages200-210
Number of pages11
Volume7
StatePublished - Dec 1 1994
EventProceedings of the 1994 7th International SAMPE Electronics Conference - Parsippany, NJ, USA
Duration: Jun 20 1994Jun 23 1994

Other

OtherProceedings of the 1994 7th International SAMPE Electronics Conference
CityParsippany, NJ, USA
Period6/20/946/23/94

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