TY - JOUR
T1 - Silica contamination of etched dentin and enamel surfaces
T2 - A scanning electron microscopic and bond strength study
AU - Perdigao, Joree
AU - Denehy, Gerald F.
AU - Swift, Edward J.
N1 - Copyright:
Copyright 2016 Elsevier B.V., All rights reserved.
PY - 1994
Y1 - 1994
N2 - Most acid-etchant gels are thickened with silica, which can leave a particulate residue on den-tinal surfaces. Some newer etchants are thickened with polymers, which reportedly leave no surface residue. This study used scanning electron microscopy to examine dentinal and enamel surfaces that had been etched with either silica- or polymer-thickened gels. The silica gels left particulate debris on dentinal surfaces, and this debris was not removed by rinsing with water. There was little evidence of this contaminant on enamel surfaces. Enamel and dentinal surfaces treated with the polymer-thickened gels appeared to be clean and uncontaminated. Shear bond strengths of composite resin to enamel and dentin etched with the different types of gel etchants were also evaluated. Silica contamination did not adversely affect bonding. In fact, etching with silica-thickened gels resulted in slightly higher bond strengths to both sub-strates. However; the differences were not statistically significant.
AB - Most acid-etchant gels are thickened with silica, which can leave a particulate residue on den-tinal surfaces. Some newer etchants are thickened with polymers, which reportedly leave no surface residue. This study used scanning electron microscopy to examine dentinal and enamel surfaces that had been etched with either silica- or polymer-thickened gels. The silica gels left particulate debris on dentinal surfaces, and this debris was not removed by rinsing with water. There was little evidence of this contaminant on enamel surfaces. Enamel and dentinal surfaces treated with the polymer-thickened gels appeared to be clean and uncontaminated. Shear bond strengths of composite resin to enamel and dentin etched with the different types of gel etchants were also evaluated. Silica contamination did not adversely affect bonding. In fact, etching with silica-thickened gels resulted in slightly higher bond strengths to both sub-strates. However; the differences were not statistically significant.
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M3 - Article
C2 - 7938417
AN - SCOPUS:0028439044
VL - 25
SP - 327
EP - 333
JO - Quintessence international (Berlin, Germany : 1985)
JF - Quintessence international (Berlin, Germany : 1985)
SN - 0033-6572
IS - 5
ER -