The inter-layer resistance in few layer graphene (FLG) is an unknown intrinsic property that affects the heat removal efficiency of FLG-based thermal devices. Here we present data that demonstrates the layer number dependence of the resistance between FLGs, by using molecular dynamics simulations. The resistance was found to decrease as the layer number increases. FLGs with larger thicknesses are proposed to be advantageous in heat spreading owing to their lower contact resistances. The observed properties do not depend on temperature, which is crucial for FLG based structures to retain a stable heat removal efficiency while working at a large temperature range.