Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases

Y. Chen; Y. Liu; F. Khatkhatay; C. Sun; H. Wang; X. Zhang

doi:10.1016/j.scriptamat.2012.04.010

Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases

Y. Chen
, Y. Liu
, F. Khatkhatay
, C. Sun
, H. Wang
, X. Zhang

Chemical Engineering and Materials Science

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

The thermal stability of sputtered Co-Cu-Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu ₅₀Ag ₅₀ and monolithic Cu. After annealing at 973 K, the grain size of Co ₃₄Cu ₃₃Ag ₃₃ was ∼115 nm, whereas that of Cu ₅₀Ag ₅₀ increased to over 700 nm. The hardness of annealed Co ₃₄Cu ₃₃Ag ₃₃ TPIN remained high, ∼3 GPa, comparing to only 1.0 GPa for Cu ₅₀Ag ₅₀ film. The remarkable thermal stability of the TPIN is largely achieved via the introduction of a third immiscible phase, forming abundant tri-phase triple junctions.

Original language	English (US)
Pages (from-to)	177-180
Number of pages	4
Journal	Scripta Materialia
Volume	67
Issue number	2
DOIs	https://doi.org/10.1016/j.scriptamat.2012.04.010
State	Published - Jul 2012

Bibliographical note

Funding Information:
X.Z. acknowledges financial support by US Army Research Office—Materials Science Division, under contract no. W911NF-09-1-0223. Partial supports by DOE-NEUP under contract no. DE-AC07-05ID14517-00088120 and NSF 1129065 are also acknowledged. We also acknowledge the usage of microscopes at the Microscopy and Imaging Center at Texas A&M University.

Keywords

Hardness
Nanocrystalline metals
Thermal stability
Tri-phase immiscible nanocomposites

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10.1016/j.scriptamat.2012.04.010

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title = "Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases",

abstract = "The thermal stability of sputtered Co-Cu-Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu 50Ag 50 and monolithic Cu. After annealing at 973 K, the grain size of Co 34Cu 33Ag 33 was ∼115 nm, whereas that of Cu 50Ag 50 increased to over 700 nm. The hardness of annealed Co 34Cu 33Ag 33 TPIN remained high, ∼3 GPa, comparing to only 1.0 GPa for Cu 50Ag 50 film. The remarkable thermal stability of the TPIN is largely achieved via the introduction of a third immiscible phase, forming abundant tri-phase triple junctions.",

keywords = "Hardness, Nanocrystalline metals, Thermal stability, Tri-phase immiscible nanocomposites",

author = "Y. Chen and Y. Liu and F. Khatkhatay and C. Sun and H. Wang and X. Zhang",

note = "Funding Information: X.Z. acknowledges financial support by US Army Research Office—Materials Science Division, under contract no. W911NF-09-1-0223. Partial supports by DOE-NEUP under contract no. DE-AC07-05ID14517-00088120 and NSF 1129065 are also acknowledged. We also acknowledge the usage of microscopes at the Microscopy and Imaging Center at Texas A\&M University. ",

year = "2012",

month = jul,

doi = "10.1016/j.scriptamat.2012.04.010",

language = "English (US)",

volume = "67",

pages = "177--180",

journal = "Scripta Materialia",

issn = "1359-6462",

publisher = "Acta Materialia Inc",

number = "2",

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TY - JOUR

T1 - Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases

AU - Chen, Y.

AU - Liu, Y.

AU - Khatkhatay, F.

AU - Sun, C.

AU - Wang, H.

AU - Zhang, X.

N1 - Funding Information: X.Z. acknowledges financial support by US Army Research Office—Materials Science Division, under contract no. W911NF-09-1-0223. Partial supports by DOE-NEUP under contract no. DE-AC07-05ID14517-00088120 and NSF 1129065 are also acknowledged. We also acknowledge the usage of microscopes at the Microscopy and Imaging Center at Texas A&M University.

PY - 2012/7

Y1 - 2012/7

N2 - The thermal stability of sputtered Co-Cu-Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu 50Ag 50 and monolithic Cu. After annealing at 973 K, the grain size of Co 34Cu 33Ag 33 was ∼115 nm, whereas that of Cu 50Ag 50 increased to over 700 nm. The hardness of annealed Co 34Cu 33Ag 33 TPIN remained high, ∼3 GPa, comparing to only 1.0 GPa for Cu 50Ag 50 film. The remarkable thermal stability of the TPIN is largely achieved via the introduction of a third immiscible phase, forming abundant tri-phase triple junctions.

AB - The thermal stability of sputtered Co-Cu-Ag tri-phase immiscible nanocomposites (TPINs) was compared to nanocrystalline Cu 50Ag 50 and monolithic Cu. After annealing at 973 K, the grain size of Co 34Cu 33Ag 33 was ∼115 nm, whereas that of Cu 50Ag 50 increased to over 700 nm. The hardness of annealed Co 34Cu 33Ag 33 TPIN remained high, ∼3 GPa, comparing to only 1.0 GPa for Cu 50Ag 50 film. The remarkable thermal stability of the TPIN is largely achieved via the introduction of a third immiscible phase, forming abundant tri-phase triple junctions.

KW - Hardness

KW - Nanocrystalline metals

KW - Thermal stability

KW - Tri-phase immiscible nanocomposites

UR - https://www.scopus.com/pages/publications/84861883050

UR - https://www.scopus.com/pages/publications/84861883050#tab=citedBy

U2 - 10.1016/j.scriptamat.2012.04.010

DO - 10.1016/j.scriptamat.2012.04.010

M3 - Article

AN - SCOPUS:84861883050

SN - 1359-6462

VL - 67

SP - 177

EP - 180

JO - Scripta Materialia

JF - Scripta Materialia

IS - 2

ER -

Significant enhancement in the thermal stability of nanocrystalline metals via immiscible tri-phases

Abstract

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Keywords

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